Semiconductor device

ABSTRACT

A standard cell has gate patterns extending in Y direction and arranged at an equal pitch in X direction. End portions of the gate patterns are located at the same position in Y direction, and have an equal width in X direction. A diode cell is located next to the standard cell in Y direction, and includes a plurality of opposite end portions formed of gate patterns that are opposed to the end portions, in addition to a diffusion layer which functions as a diode.

CROSS-REFERENCE TO RELATED APPLICATION

This is a Continuation of application Ser. No. 13/179,214, filed on Jul.8, 2011, now U.S. Pat. No. 8,399,928, which is a continuation of PCTInternational Application PCT/JP2011/000927, filed on Feb. 18, 2011,which claims priority to Japanese Patent Application No. 2010-114517,filed on May 18, 2010. The disclosures of these applications includingthe specifications, the drawings, and the claims are hereby incorporatedby reference in their entirety.

BACKGROUND

The present disclosure relates to layouts of semiconductor devices, andspecifically relates to techniques effective for reducing an opticalproximity effect.

In a general process for fabricating a semiconductor integrated circuit,a photolithography step including application of a resist, lightexposure, and development, an etching step for patterning elements usinga resist mask, and a step of removing the resist are repeated to form anintegrated circuit on a semiconductor substrate. If pattern dimensionsare equal to or smaller than the wavelength of the exposure light in thephotolithography step, differences between the designed layoutdimensions and the pattern dimensions formed on the semiconductorsubstrate become large due to an optical proximity effect of thediffracted light.

In a semiconductor integrated circuit, the gate length of a transistoris an important factor which influences the performance of thesemiconductor integrated circuit. Thus, if variations in gate dimensionsoccur in the fabrication process, it significantly affects theoperational performance of the semiconductor integrated circuit.

For this reason, with the progression of miniaturization, it becomesessential to correct the variations in pattern dimensions caused by theoptical proximity effect, when patterns such as a wire are drawn andexposed to light in the fabrication process of the semiconductorintegrated circuit. Examples of the technique for correcting the opticalproximity effect include an optical proximity effect correction (OPC).The OPC is a technique in which an amount of change in the gate lengthdue to an optical proximity effect is predicted from a distance betweena gate and its adjacent gate pattern, and the mask measurements of thephotoresist for forming the gate are corrected beforehand to compensatethe predicted amount of change, thereby maintaining the finishedmeasurements of the gate length after light exposure constant.

However, in conventional techniques, gate patterns have not beenstandardized and there have been various gate lengths and gate spaces onthe entire chip. Thus, problems such as an increase in turn around time(TAT) or an increase in amount of processing are caused by the gate maskcorrection by OPC.

SUMMARY

According to Japanese Patent Publication No. 2000-106419, for example, aprotection diode is used for satisfying an antenna rule. However, ingeneral, no gate is provided on a diode cell, and therefore, there areno regulations for the gate length and the gate space. Thus, the gatedimensions cannot be regulated. Here, a diode cell is a cell which formsan diode for protecting a transistor from a phenomenon referred to as an“antenna effect” in which electro static discharge (ESD) occurs becausethe gate of the transistor or a metal wire connected to the gate ischarged due to irradiation of plasma.

FIG. 14 shows an example layout pattern of a semiconductor device havinga conventional diode cell. In FIG. 14, gate patterns G1, G2, G3 areprovided in the standard cell C1. The diode cell C2 includes a firstdiode A1 and a second diode A2 connected to each other in series and ina forward direction. A contact for connecting a diffusion region and ametal wire in the upper layer, and an input connection terminal INplaced on the metal wire in the upper layer are provided between thefirst diode A1 and the second diode A2. With this configuration, thediode cell C2 functions as a bypass of a charge current path passingthrough a gate oxide film of the MOS transistor, and functions as aprotection diode cell for satisfying the antenna rule.

Here, gate patterns opposed to the end portions of the gate patterns G1,G2, G3 do not exist in a region R1. Thus, the end portions of the gatepatterns G1, G2, G3 do not have shape regularity, which leads tovariations of the gate length due to an optical proximity effect.

It is an objective of the present invention to provide, in asemiconductor device having a diode cell, a layout of a standard celllocated next to the diode cell according to which variations in gatelength caused by an optical proximity effect can be reliably prevented.

According to one aspect of the present invention, a semiconductor deviceincludes: a standard cell having three or more gate patterns extendingin a first direction and arranged at an equal pitch along a seconddirection orthogonal to the first direction; and a diode cell locatednext to the standard cell in the first direction, wherein the gatepatterns included in the standard cell terminate near a cell boundarybetween the standard cell and the diode cell, with respective endportions located at a same position in the first direction and having anequal width in the second direction, and the diode cell includes: atleast one diffusion layer which functions as a diode; and a plurality ofopposite end portions formed of a gate pattern, which are located nearthe cell boundary and opposed to the end portions of the gate patternsincluded in the standard cell.

According to this aspect of the present invention, the standard cellincludes three or more gate patterns arranged at an equal pitch, and thediode cell is located next to the standard cell in the first direction.The end portions of the gate patterns included in the standard cell nearthe cell boundary are located at the same position in the firstdirection, and have an equal width in the second direction. Further, thediode cell includes, in addition to at least one diffusion layer whichfunctions as a diode, a plurality of opposite end portions formed ofgate patterns and opposed to the end portions of the gate patternsincluded in the standard cell near the cell boundary. With thisconfiguration, the end portions of the gate patterns in the standardcell can have shape regularity by the presence of the opposite endportions formed of the gate patterns in the diode cell. Thus, it ispossible to reliably prevent variations in gate length caused by anoptical proximity effect.

According to a semiconductor device of the present invention, it ispossible to reliably prevent variations in gate length caused by anoptical proximity effect, in a standard cell located next to a diodecell.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified view of a layout pattern of a semiconductordevice according to the first embodiment.

FIG. 2 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the first embodiment.

FIG. 3 is a simplified view of a layout pattern of a semiconductordevice according to the second embodiment.

FIG. 4 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the second embodiment.

FIG. 5 is a simplified view of a layout pattern of a semiconductordevice according to the third embodiment.

FIG. 6 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the third embodiment.

FIG. 7 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the third embodiment.

FIG. 8 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the third embodiment.

FIG. 9 is a simplified view of a layout pattern of a semiconductordevice according to the fourth embodiment.

FIG. 10 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the fourth embodiment.

FIG. 11 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the fourth embodiment.

FIG. 12 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the fourth embodiment.

FIG. 13 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the fourth embodiment.

FIG. 14 is a simplified view of a layout pattern of a semiconductordevice having a conventional diode cell.

DETAILED DESCRIPTION

Embodiments of the present invention will be described hereinafter withreference to the drawings.

First Embodiment

FIG. 1 is a simplified view of a layout pattern of a semiconductordevice according to the first embodiment. FIG. 1 shows a layout of gatepatterns, diffusion regions, contacts, and a metal wire. The cellboundary between adjacent cells is shown in solid line as in the otherdrawings. The gate pattern refers to a pattern formed in a layer usedfor a gate electrode of a transistor, and is made of material such aspolysilicon. The transistor is configured by the gate pattern and thediffusion regions. Part of the gate pattern that is sandwiched betweenthe diffusion regions functions as a gate of the transistor. As shown inFIG. 1, the standard cell C1 extends in Y direction (i.e., thelongitudinal direction of the drawing) as a first direction, andincludes gate patterns G1, G2, G3 arranged at an equal pitch in Xdirection (i.e., the lateral direction of the drawing) as a seconddirection. The width of each of the gate patterns G1, G2, G3 is L1, andthe space between adjacent ones of the gate patterns G1, G2, G3 is S1.The gate pattern G2 forms a transistor T1. In general, to place atransistor at a higher area efficiency, the width L1 and the space S1 ofthe gate patterns G1, G2, G3 have a minimum dimension. Regarding thestandard cell C1, a layout of only a gate pattern and a diffusion regionis shown, and a contact and a metal wire are not shown as in the otherdrawings.

The diode cell C2 is located next to the standard cell C1 in Ydirection. The diode cell C2 includes diffusion region patterns D1-D8for forming a diffusion region which functions as a diode. The diffusionregions D1-D8 are connected to each other by a metal wire in the upperlayer, and an input connection terminal IN is provided, so the diodecell C2 functions as a protection diode. The diffusion regions D1-D4 andthe diffusion regions D5-D8 have the same lengths in Y direction,respectively. Further, the diode cell C2 includes a plurality of gatepatterns G4, G5, G6 extending in Y direction. The gate patterns G4, G5,G6 are dummy patterns, and have an equal length in Y direction. Each ofthe diffusion regions D1-D8 is located between gate patterns includingthe gate patterns G4, G5, G6.

Now, an end portion region R1 in which the gate patterns G1, G2, G3included in the standard cell C1 are opposed to the gate patterns G4,G5, G6 included in the diode cell C2 will be described. The gatepatterns G1, G2, G3 terminate near the cell boundary between thestandard cell C1 and the diode cell C2. The end portions e1, e2, e3 ofthe gate patterns G1, G2, G3 are located at the same position in Ydirection, and have an equal width in X direction (i.e., the width L1).The gate patterns G4, G5, G6 have a plurality of opposite end portionseo1, eo2, eo3 opposed to the end portions e1, e2, e3 of the gatepatterns G1, G2, G3. The opposite end portions eo1, eo2, eo3 are locatedat the same position in Y direction. In other words, the gate patternsG1, G2, G3 included in the standard cell C1 are spaced apart from thegate patterns G4, G5, G6 included in the diode cell C2 at an equaldistance in Y direction. Thus, the gate patterns G1, G2, G3 have shaperegularity, and variations in gate length caused by an optical proximityeffect can be prevented.

FIG. 2 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the present embodiment. Theconfiguration shown in FIG. 2 is approximately the same as theconfiguration shown in FIG. 1, but the shapes of the gate patterns inthe diode cell C2 is slightly different. Specifically, in addition tothe gate patterns G4, G5, G6 extending in Y direction, a gate pattern G7as a second gate pattern extending in X direction is provided. The gatepattern G7 is connected to each of the gate patterns G4, G5, G6 suchthat a grid gate pattern is formed in the diode cell C2. By making thegate patterns have a grid structure, it is possible to increase aminimum area of the gate patterns, and possible to prevent a patternerror which occurs in the course of formation of polysilicon.

Second Embodiment

FIG. 3 is a simplified view of a layout pattern of a semiconductordevice according to the second embodiment. The configuration shown inFIG. 3 is approximately the same as the configuration shown in FIG. 1,but the shapes of the gate patterns and the shapes of the diffusionregions in the diode cell C2 are slightly different. Specifically, inFIG. 3, the gate patterns G4, G5, G6 included in the diode cell C2 arearranged at a pitch equal to the pitch at which the gate patterns G1,G2, G3 included in the standard cell C1 are arranged in X direction; therespective opposite end portions eo1, eo2, eo3 of the gate patterns G4,G5, G6 are located at the same position in Y direction and have an equalwidth in X direction. Further, diffusion regions D1-D5 are arrangedbetween the gate patterns at an equal pitch in X direction. The endportions of the diffusion regions D1-D5 are located at the same positionin Y direction, and have an equal width in X direction. Similarly,diffusion regions D6-D10 are arranged between the gate patterns at anequal pitch in X direction. The end portions of the diffusion regionsD6-D10 are located at the same position in Y direction, and have anequal width in X direction. The diffusion regions D1-D10 are connectedto each other by a metal wire in the upper layer, and an inputconnection terminal IN is provided, so the diode cell C2 functions as aprotection diode.

According to the present embodiment, the end portions e1, e2, e3 of thegate patterns G1, G2, G3 in the standard cell C1 and the opposite endportions eo1, eo2, eo3 of the gate patterns in the diode cell C2 havethe same shape regularity in the end portion region R1 in which the gatepatterns G1, G2, G3 included in the standard cell C1 are opposed to thegate patterns G4, G5, G6 included in the diode cell C2. Therefore, it ispossible to reliably prevent variations in gate length caused by anoptical proximity effect.

FIG. 4 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the present embodiment. Theconfiguration shown in FIG. 4 is approximately the same as theconfiguration shown in FIG. 3, but the shapes of the gate patterns inthe diode cell C2 are slightly different. Specifically, in addition tothe gate patterns G4, G5, G6 extending in Y direction, a gate pattern G7extending in X direction is provided. The gate pattern G7 is connectedto each of the gate patterns G4, G5, G6 such that a grid gate pattern isformed in the diode cell C2. By making the gate patterns have a gridstructure, it is possible to increase a minimum area of the gatepatterns, and possible to prevent a pattern error which occurs in thecourse of formation of polysilicon.

By making the gate patterns of each cell have the same shape andarranged at the same distance as in the present embodiment, it ispossible to predict an amount of change in gate pattern caused by anoptical proximity effect, and possible to make corrections by OPC in thestate of standard cells. Thus, there is no need to make corrections byOPC after placement of the cells.

Third Embodiment

FIG. 5 is a simplified view of a layout pattern of a semiconductordevice according to the third embodiment. The configuration shown inFIG. 5 is approximately the same as the configuration shown in FIG. 1,but the shapes of the diffusion regions in the diode cell C2 areslightly different. Specifically, in FIG. 5, a diffusion region D11having a continuous shape in which the diffusion regions D1-D4 of FIG. 1are connected together and sandwiching the gate patterns G4, G5, G6, isprovided. Similarly, a diffusion region D12 having a continuous shape inwhich the diffusion regions D5-D8 of FIG. 1 are connected together andsandwiching the gate patterns G4, G5, G6, is provided. The gate patternsG4, G5, G6 sandwiched between the diffusion regions D11, D12 function asgates of the transistor. The contacts placed on the gates G4, G5, G6 andthe contacts placed on the diffusion regions D11, D12 are connectedtogether by a metal wire in the upper layer to serve as a node, and aninput connection terminal IN is provided, so the diode cell C2 functionsas a protection diode.

The configuration shown in FIG. 5 can provide a similar effect as theconfiguration shown in FIG. 1. In addition, since the diffusion regionsD11, D12 in the diode cell C2 are continuous diffusion regions, thediffusion regions D11, D12 can be easily formed, and it is possible toprevent misplacement of a contact due to a small diffusion region.Further, the junction capacitance of the diode can be increased byincreasing the area of the diffusion region. Furthermore, it becomespossible to provide a plurality of types of diode cells C2 having thesame cell size in X direction, thereby preventing an unnecessaryincrease in junction capacitance of the diode.

FIG. 6 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the present embodiment. Theconfiguration shown in FIG. 6 is the same as the configuration shown inFIG. 2 except that the diffusion regions D1-D4 are replaced with acontinuous diffusion region D11, and that the diffusion regions D5-D8are replaced with a continuous diffusion region D12. Thus, it ispossible to obtain an effect similar to the effect of the configurationin FIG. 5 in addition to an effect similar to the effect of theconfiguration in FIG. 2.

FIG. 7 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the present embodiment. Theconfiguration shown in FIG. 7 is the same as the configuration shown inFIG. 3 except that the diffusion regions D1-D5 are replaced with acontinuous diffusion region D11, and that the diffusion regions D6-D10are replaced with a continuous diffusion region D12. Thus, it ispossible to obtain an effect similar to the effect of the configurationin FIG. 5 in addition to an effect similar to the effect of theconfiguration in FIG. 3.

FIG. 8 is a simplified view of a layout pattern of a semiconductordevice according to a variation of the present embodiment. Theconfiguration shown in FIG. 8 is the same as the configuration shown inFIG. 4 except that the diffusion regions D1-D5 are replaced with acontinuous diffusion region D11, and that the diffusion regions D6-D10are replaced with a continuous diffusion region D12. Thus, it ispossible to obtain an effect similar to the effect of the configurationin FIG. 5 in addition to an effect similar to the effect of theconfiguration in FIG. 4.

Fourth Embodiment

FIG. 9 is a simplified view of a layout pattern of a semiconductordevice according to the fourth embodiment. The configuration shown inFIG. 9 is approximately the same as the configuration shown in FIG. 7.In the end portion region R1, the end portions e1, e2, e3 and theopposite end portions eo1, eo2, eo3 have the same shape regularity.However, the internal configuration of the diode C2 is different fromthat shown in FIG. 7.

In FIG. 9, the diode cell C2 has a gate pattern G8 which is a dummypattern. The gate pattern G8 includes a pattern body 8 a extending in Xdirection, and a plurality of protrusions 8 b protruding from thepattern body 8 a toward the standard cell C1 in Y direction. Theprotrusions 8 b form opposite end portions eo1, eo2, eo3. In otherwords, the gate pattern G8 has a so-called “crown” shape or “tooth”shape. In a region R2, the contacts placed on the diffusion regions D11,D12 are connected together by a metal wire in the upper layer, and aninput connection terminal IN is provided, so the diode cell C2 functionsas a protection diode.

According to the configuration shown in FIG. 9, the gate pattern G8 as adummy pattern attains the same shape regularity as the gate patternsopposed to the gate pattern G8 in the end portion region R1 at the cellboundary between the standard cell C1 and the diode cell C2. Thus,variations in gate length caused by an optical proximity effect can bereliably prevented.

FIGS. 10-13 are simplified views of layout patterns of semiconductordevices according to variations of the present embodiment. In FIG. 10,the gate pattern G8 and the diffusion region D11 are overlapped in thediode cell C2 to ensure the diode area. In FIG. 11, the gate pattern isformed so as to surround the contacts in the diode cell C2. In FIG. 12,a gate pattern G9 as a dummy pattern having two opposite end portionseo2, eo3 is formed in the diode cell C2. In FIG. 13, the gate pattern G8is connected to another gate pattern in the diode cell C2 to ensure thegate pattern area.

According to a semiconductor device of the present invention, it ispossible to reliably prevent variations in gate length caused by anoptical proximity effect in a standard cell located next to a diodecell. Thus, there is no need to make a correction again by OPC afterplacement of the standard cell, which makes it possible to reduce thenumber of design steps. Thus, for example, the present invention isuseful for a semiconductor integrated circuit mounted on various typesof electronic equipment.

What is claimed is:
 1. A semiconductor device, comprising: a standardcell having three or more gate patterns extending in a first directionand arranged at an equal pitch along a second direction orthogonal tothe first direction; and a diode cell located next to the standard cellin the first direction, wherein: the gate patterns included in thestandard cell terminate near a cell boundary between the standard celland the diode cell, with respective end portions located at a sameposition in the first direction and having an equal width in the seconddirection, the diode cell includes: a plurality of diffusion regionpatterns; and a plurality of opposite end portions formed of a gatepattern, which are located near the cell boundary and opposed to the endportions of the gate patterns included in the standard cell, and atleast one of the plurality of diffusion region patterns functions as adiode.
 2. The semiconductor device of claim 1, wherein the diode cellincludes a plurality of gate patterns extending in the first directionand respectively having the plurality of opposite end portions.
 3. Thesemiconductor device of claim 2, wherein the diode cell includes asecond gate pattern extending in the second direction and connected tothe plurality of gate patterns such that a grid gate pattern is formedin the diode cell.
 4. The semiconductor device of claim 2, wherein theplurality of gate patterns included in the diode cell are arranged at apitch equal to the pitch at which the gate patterns included in thestandard cell are arranged in the second direction, with the pluralityof opposite end portions located at a same position in the firstdirection and having an equal width in the second direction.
 5. Thesemiconductor device of claim 4, wherein the plurality of diffusionregion patterns included in the diode cell are arranged between theplurality of gate patterns at an equal pitch in the second direction,and have an equal width in the second direction.
 6. The semiconductordevice of claim 1, wherein the gate pattern included in the diode cellis a dummy pattern.
 7. The semiconductor device of claim 2, wherein inthe diode cell, the plurality of diffusion region patterns are arrangedso as to sandwich at least one of the plurality of gate patterns, andthe gate pattern sandwiched between the plurality of diffusion regionpatterns functions as a gate of a transistor.
 8. The semiconductordevice of claim 1, wherein: the diode cell has a dummy pattern whichforms at least part of the plurality of opposite end portions, the dummypattern includes a pattern body extending in the second direction, andtwo or more protrusions protruding from the pattern body toward thestandard cell in the first direction, and the protrusions form theopposite end portions.
 9. The semiconductor device of claim 1, whereinthe plurality of diffusion region patterns are connected to each otherby a metal wire in an upper layer.
 10. The semiconductor device of claim1, wherein the diode cell has an input terminal and the input terminalis connected to the at least one of the plurality of diffusion regionpatterns.
 11. The semiconductor device of claim 1, wherein the pluralityof diffusion region patterns have an equal length in the firstdirection.
 12. The semiconductor device of claim 2, wherein theplurality of gate patterns in the diode cell have an equal length in thefirst direction.
 13. The semiconductor device of claim 12, wherein theplurality of gate patterns in the diode cell are dummy patterns.
 14. Thesemiconductor device of claim 1, wherein the plurality of opposite endportions are located at the same position in the first direction. 15.The semiconductor device of claim 1, wherein the plurality of diffusionregion patterns are arranged at an equal pitch along the seconddirection.
 16. The semiconductor device of claim 1, wherein theplurality of diffusion region patterns have an equal width in the seconddirection.
 17. The semiconductor device of claim 1, wherein end portionsof the plurality of diffusion region patterns are located at a sameposition in the first direction.
 18. The semiconductor device of claim2, wherein the plurality of diffusion region patterns are connectedtogether and sandwiching the gate patterns.